Find Your Funding Opportunity
National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development (R&D)
Service
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Source |
Final Application Due Date |
Funding Available
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Match Required
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|---|---|---|---|---|
| Community Improvement & Capacity Building |
Federal
DOC |
12-20-2024 | N/A | No Match Required |
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Service
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Source
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Final Application Due Date
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Funding Available
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Match Required
Status
- Expected Number of Awards 10
- Opportunity Type Discretionary
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CFDA
11.042 -- CHIPS Research and Development
Description
Applications such as high performance computing and low-power electronics, both needed for artificial intelligence (AI), require leap-ahead advances in semiconductor advanced packaging. This Notice of Funding Opportunity (NOFO) seeks proposals for R&D activities that will establish and accelerate domestic semiconductor advanced packaging through investments in five (5) R&D Areas: (1) Equipment, Tools, Processes, and Process Integration; (2) Power Delivery and Thermal Management; (3) Connector Technology, including Photonics and Radio Frequency (RF); (4) Chiplets Ecosystem; and (5) Co-design/Electronic Design Automation (EDA).
Eligibility
- IHE
- Local Government
- Non-Profit
- Other
- State Government
- Tribal Government
Additional Eligibility Information
Eligible applicants are domestic non-profit organizations; domestic accredited institutions of higher education; State, local, and Tribal governments; and domestic for-profit organizations. A domestic entity is one that is incorporated within the United States (including a U.S. territory) with its principal place of business in the United States (including a U.S. territory).
Key Date(s)
- October 18, 2024: Last Updated Date
- October 18, 2024: Posted Date
- December 20, 2024: Current Closing Date for Applications
- December 20, 2024: Application Due Date
- January 19, 2025: Application Archive Date
Contact Information
Misty L Roosa
Management Analyst