Find Your Funding Opportunity

DE-FOA-0003426: RFI Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) R&D Roadmap — Public Feedback
Bookmarked grants will display in your Account Setting page

Service Source Final Application Due Date Funding Available Match Required
Environment Federal
DOE
09-30-2024 N/A No Match
Required
  • Service
  • Source
  • Final Application Due Date
  • Funding Available
  • Match Required
Status
  • Past
  • Current
  • Forecasted
  • $1
  • $2
  • Award Floor
  • Award Ceiling
    • Opportunity Type Discretionary
    • CFDA

      81.086 -- Conservation Research and Development

    Description

    This is a Request for Information (RFI) issued by the U.S. Department of Energy (DOE) on behalf of the Advanced Materials and Manufacturing Technologies Office (AMMTO). The intent of this RFI is to solicit feedback from affected stakeholders on the EES2 Initiative in general and on the draft Microelectronics Energy Efficiency Scaling for 2 Decades (EES2) Research, Development, and Demonstration (RD&D) Roadmap that accompanies this RFI. The EES2 roadmap focuses on the energy efficiency of computing and the computing stack. Therefore, we have divided our roadmap into eight specialized working groups, each focusing on specific layers of the computing stack or on enabling technologies and approaches. Working group deliberations focused on identifying key emerging, energy-efficient technologies and their challenges and solutions. The EES2 working groups for version 1.0 are: a. Materials and Devices (MnD) b. Circuits and Architectures (CnA) c. Advanced Packaging and Heterogenous Integration (APHI) d. Algorithms and Software (AnS) e. Power and Control Electronics (PaCE) f. Manufacturing Energy Efficiency and Sustainability (MEES) g. Metrology and Benchmarking (MnB) h. Education and Workforce Development (EWD) Responses to this RFI must be submitted electronically to micro.electronics@ee.doe.gov no later than 5:00pm (EDT) on September 30, 2024. Responses must be provided as a Microsoft Word (.docx) attachment to an email. It is recommended that attachments with file sizes exceeding 25MB be compressed (i.e., zipped) to ensure message delivery. This RFI is not accepting applications for financial assistance or financial incentives. EERE may or may not issue a Funding Opportunity Announcement (FOA) based on consideration of the input received from this RFI. Please see the full RFI document for additional information.

    Eligibility
    • IHE
    • Local Government
    • Non-Profit
    • Other
    • State Government
    • Tribal Government
    Key Date(s)
    • August 14, 2024: Last Updated Date
    • August 14, 2024: Posted Date
    • September 30, 2024: Current Closing Date for Applications
    • September 30, 2024: Application Due Date
    • October 30, 2024: Application Archive Date
    Contact Information

    micro.electronics@ee.doe.gov

    micro.electronics@ee.doe.gov

    DROP US A LINE

    Feedback Feedback

    Your opinion is important to us

    • How would you rate your overall experience on our website?

    • How easy is it to find the information you need?

    • How do you rate the look & feel of our website?

    • How could we improve our website?