Find Your Funding Opportunity
FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
Service
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Source |
Final Application Due Date |
Funding Available
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Match Required
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|---|---|---|---|---|
| Community Improvement & Capacity Building |
Federal
DOC |
07-03-2024 | N/A | No Match Required |
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Service
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Source
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Final Application Due Date
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Funding Available
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Match Required
Status
- Opportunity Type Discretionary
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CFDA
11.042 -- CHIPS Research and Development
Description
The CHIPS Research and Development Program (CHIPS R&D) aims to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. This is the first Notice of Funding Opportunity under this program. It seeks applications for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for producing microelectronics systems.
Eligibility
- IHE
- Local Government
- Non-Profit
- Other
- State Government
- Tribal Government
Additional Eligibility Information
Eligible applicants include domestic for-profit and non-profit organizations; accredited domestic institutions of higher education including community and technical colleges; and state, local, territorial, and Indian tribal governments. Eligible applicants may only submit one full application under this NOFO. Entities may not be included as subrecipients on more than two applications.
Key Date(s)
- February 28, 2024: Last Updated Date
- February 28, 2024: Posted Date
- July 03, 2024: Current Closing Date for Applications
- July 03, 2024: Application Due Date
- August 02, 2024: Application Archive Date
Contact Information
Misty L Roosa
Management Analyst